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30g SMD Tin Solder Paste Syringe Low Dross for BGA Rework IC Reballing Soldering SMD Components etc.

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Product ID: 220955489

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About the item

🔧 Solder Like a Pro: Elevate Your Electronics Game! Designed with a viscosity of 160 Pa.s for smooth application. Perfect for SMT/SMD electronic components. Minimizes waste, maximizing your soldering efficiency. Comes with a 25-gauge needle for precise application. Crafted for flawless BGA rework and IC reballing. Viscosity: 160 Pa.s Alloy: Sn63/Pb37 Melting Point: 138°C The 30g SMD Tin Solder Paste Syringe is a high-quality soldering solution featuring a low dross formula, ideal for BGA rework and IC reballing. With a melting point of 138°C and a viscosity of 160 Pa.s, this product ensures optimal flow and precision in soldering SMT/SMD electronic components. Each syringe includes a 25-gauge needle for easy application, making it a must-have for professionals and hobbyists alike.

Alloy: Sn63/Pb37 | Microns: 25-45um | Melting point: 138 ° C | Viscosity: 160 Pa.s | Application For: Soldering SMT/SMD Electronic Components. | Net Weight: 30-Grams..
Package Includes: 30g Tin Solder Paste Syringe With 25-Guage Needle..

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